|
If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
Datasheet File OCR Text: |
ILX510 5150-pixel CCD Linear Sensor (B/W) For the availability of this product, please contact the sales office. Description The ILX510 is a reduction type CCD linear sensor developed for high resolution copiers. This sensor reads A3-size documents at a density of 400 DPI, and A4-size documents at a density of 600 DPI at high speed. Features * Number of effective pixels: 5150 pixels * Pixel size: 7 mx7 m (7 m pitch) * Signal output phase of two-output simultaneous-output (alternate-output is available) * Ultra high sensitivity/Ultra low lag * Max Data Rate: 40 MHz * Single 12 V power supply * Input Clock Pulse: CMOS 5V drive * Package: 22 pin cer-DIP (400 mil) Absolute Maximum Ratings * Supply voltage VDD * Operating temperature * Storage temperature Pin Configuration (TOP VIEW) 20 pin DIP (Cer-DIP) Block Diagram fROG pulse generator 1-EVEN CCD analog shift register CCD analog shift register 2-EVEN Read out gate Read out gate VGG 2 1 21 GND LH-EVEN LH-ODD VDD D25 D26 17 VOUT-ODD RS-EVEN RS-ODD 5 LH-ODD 6 NC 7 GND 8 18 RS-EVEN 17 LH-EVEN Output amplifer VDD 19 Output amplifer 16 NC GND 15 NC 14 2-EVEN 13 1-EVEN 5150 12 ROG VOUT-EVEN 1-ODD 10 VDD 11 Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. --1-- VOUT-ODD GND 2-ODD 9 21 20 22 2 VGG 3 E94106-TE 4 RS-ODD VDD 4 19 VDD 18 5 6 3 20 VOUT-EVEN D74 NC 1 22 GND GND 8 2-ODD 14 9 1-ODD S5149 S5150 D75 15 -10 to +60 -30 to +80 V C C 13 10 S2 S1 VDD 11 ROG 12 D94 ILX510 Pin Description Pin No 1 2 3 4 5 6 7 8 9 10 11 Symbol NC VGG VOUT-ODD VDD RS-ODD LH-ODD NC GND 2-ODD 1-ODD VDD Description NC Output circuit gate bias Signal out (odd pixel) 12 V power supply Clock pulse input (odd pixel) Clock pulse input (odd pixel) NC GND Clock pulse input (odd pixel) Clock pulse input (odd pixel) 12 V power supply Pin No 12 13 14 15 16 17 18 19 20 21 22 Symbol ROG 1-EVEN 2-EVEN NC NC LH-EVEN RS-EVEN VDD VOUT-EVEN GND GND Description Readout gate clock pulse input Clock pulse input (even pixel) Clock pulse input (even pixel) NC NC Clock pulse input (even pixel) Clock pulse input (even pixel) 12 V power supply Signal out (even pixel) GND GND Recommended Supply Voltage Item VDD Min. 11.4 Typ. 12 Max. 12.6 Unit V Clock Characteristics Item Input capacity of 1, f2 Input capacity of LH Input capacity of RS Input capacity of ROG Symbol C1, C2 CLH CRS CROG Min. -- -- -- -- Typ. 400 10 10 10 Max. -- -- -- -- Unit pF pF pF pF It indicates that 1-ODD, 1-EVEN as 1, 2-ODD, 2-EVEN as 2, LH-ODD, LH-EVEN as LH, RS-ODD, RS-EVEN as RS. Clock Frequency Item 1, 2, LH, RS Data rate Symbol f1, f2,fLH,fRS fR Min. -- -- Typ. 1 2 Max. 20 40 Unit MHz MHz Input Clock Pulse Voltage Condition Item 1, 2, LH, RS, ROG pulse voltage High level Low level Min. 4.75 -- Typ. 5.0 0 Max. 5.25 0.1 Unit V V --2-- ILX510 Electrooptical Characteristics (Note 1) (Ta = 25 C, VDD = 12 V, Data rate fR=2 MHz, Simultaneous output, Input clock =5 Vp-p Light source = 3200 K, IR cut filter CM-500S (t = 1.0 mm) Item Sensitivity 1 Sensitivity 2 Sensitivity nonuniformity Saturation output voltage Saturation exposure Register imbalance Dark voltage average Dark signal nonuniformity Image lag Supply current Total transfer efficiency Output impedance Offset level Dynamic range Symbol R1 R2 PRNU VSAT SE RI VDRK DSNU IL IVDD TTE ZO VOS DR Min. 9 -- -- 1.0 0.067 -- -- -- -- -- 92 -- -- 500 Typ. 12 27.4 4 1.5 0.125 2 0.3 0.6 0.02 30 98 150 6.5 5000 Max. 15 -- 10 -- -- 7 2.0 3.0 -- 60 -- -- -- -- Unit Remarks V/(lx * s) Note2 V/(lx * s) Note3 % Note4 V Note5 lx * s Note6 % Note7 mV Note8 mV Note9 % Note10 mA -- % -- -- V Note11 -- Note12 Note 1) In accordance with the given electrooptical characteristics, the even black level is defined as the average value of D6, D8 to D24. The odd black level is defined as the average value of D5, D7 to D23. 2) For the sensitivity test light is applied with a uniform intensity of illumination. 3) W lamp (2854 K). 4) PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2. VOUT=500 mV (Typ.) PRNU = (VMAX - VMIN)/2 x100 (%) VAVE Where the 5150 pixels are divided into blocks of 103, even and odd pixels, respectively. The maximum output of each block is set to VMAX, the minimum output to VMIN and the average output to VAVE. 5) Use below the minimum value of the saturation output voltage. 6) Saturation exposure is defined as follows. SE = VSAT R1 7) RI is defined as indicated below. VOUT=500 mV (Typ.) RI = VODD-AVE - VEVEN-AVE x100 (%) VODD-AVE + VEVEN-AVE 2 ( ) Where average of odd pixels output is set to VODD-AVE, even pixels to VEVEN-AVE. --3-- ILX510 8) Optical signal accumulated time int stands at 10 ms. 9) The difference between the maximum and average values of the dark output voltage is calculated for even and odd respectivery. The larger value is defined as the dark signal nonuniformity. Optical signal accumulated time t int stands at 10 ms. 10) VOUT = 500 mV (Typ.) 11) Vos is defined as indicated bellow. VOUT VOS GND 12) Dynamic range is defined as follows. DR = VSAT VDRK When the optical signal accumulated time is shorter, the dynamic range gets wider because the optical signal accumulated time is in proportion to the dark voltage. --4-- Clock Timing Chart 1 (simultaneous output) ROG 5 0 2 3 2622 D27 D73 S1 D25 D69 D23 D71 S3 S5145 S5149 D77 D79 S5147 D75 D81 D83 D28 D74 S2 D26 D70 D24 D72 S4 S5146 S5150 D78 D80 1-ODD 5 1-EVEN LH-ODD 0 LH-EVEN 2-ODD 2-EVEN 5 0 RS-ODD 5 RS-EVEN 0 D3 D5 D93 D94 D82 D84 VOUT-ODD D1 D4 D6 D2 1 --5-- Optical black (48 pixels) Dummy signal (74 pixels) 1-line output period (5244 pixels) VOUT-EVEN Note) The transfer pulses (1, 2, LH) must have more than 2622 cycles. S5148 D76 ILX510 ILX510 Clock Timing Chart 2 t4 t5 ROG t6 t2 t7 1 LH 2 t1 t3 Clock Timing Chart 3 t7 1 LH t14 t6 t15 t17 2 t16 t10 RS t9 t8 t11 VOUT-ODD VOUT-EVEN t12 t13 Clock timing of 1, 2, LH, RS, and VOUT at odd or even are the same as timing chart 3 in the case of alternate output. --6-- ILX510 Clock Timing Chart 4 Cross point 1 and 2 1 5V 1.5V (Min.) 2 0V 1.5V (Min.) Cross point LH and 2 2 5V 2.0V (Min.) LH 0V 0.5V (Min.) --7-- Clock Timing Chart 5 (alternate output) ROG 3 2622 D23 D27 D69 D71 S5147 D73 S3 S5149 D75 D81 D25 S1 S5145 D77 D79 D83 D93 D82 D80 D84 D94 D76 D78 S2 S4 D70 D24 D26 D28 D72 D74 S5148 5 0 5 1-ODD LH-ODD 0 2-ODD 5 0 5 1-EVEN LH-EVEN 0 2-EVEN 5 0 RS-ODD D5 5 0 D1 1 D2 D4 VOUT-EVEN Optical black (48 pixels) Dummy signal (74 pixels) D6 1-line output period (5244 pixels) Note) The transfer pulses (1, 2, LH) must have more than 2622 cycles. Alternate output is available by making 1-EVEN, 2-EVEN, LH-EVEN, RS-EVEN delayed to 1-ODD, 2-ODD, LH-ODD, RS-ODD for half a cycle. ILX510 S5146 S5150 --8-- VOUT-ODD RS-EVEN 5 0 D3 2 ILX510 Clock Pulse Recommended Timing ROG, 1pulse timing ROG pulse high level period ROG, 1 pulse timing ROG pulse rise time ROG pulse fall time 1 pulse rise time /2 pulse fall time 1 pulse fall time / 2 pulse rise time RS pulse high level period RS, LH pulse timing RS pulse rise time RS pulse fall time Signal output delay time 1, LH pulse low level period/2 pulse high level period 1, LH pulse high level period/2 pulse low level period Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14, t16 t15, t17 Min. 50 600 400 0 0 0 0 20 0 0 0 -- -- 25 25 Typ. 100 1000 1000 5 5 20 20 250 250 10 10 8 8 500 500 Max. -- -- -- 10 10 60 60 -- -- 30 30 -- -- -- -- Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns () These timing is the recommended condition under f1=1 MHz. --9-- Application Circuit (inphase output) 5.1k VOUT-EVEN Tr1 100 IC1 ROG 22 21 20 19 18 17 16 15 14 13 12 NC GND GND VDD NC VOUT-EVEN RS-EVEN LH-EVEN 2-ODD 2-EVEN VGG VOUT-ODD RS-ODD VDD LH-ODD GND 1-ODD 1-EVEN --10-- NC NC 1 2 3 4 5 6 7 8 9 10 12V 0.1F 100 Tr1 100 100 2 2 0.1F 47F/16V IC1 VOUT-ODD 5.1k RS LH 2 1 VDD 11 ROG IC1 : 74AC04 Tr1 : 2SC2785 Data rate fR = 2 MHz ILX510 Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party and other right due to same. ILX510 Example of Representative Characteristics (VDD = 12 V, Ta = 25 C) Spectral sensitivity characteristics (Standard characteristics) 1.0 0.8 Relative sensitivity 0.6 0.4 0.2 0 400 500 600 700 800 900 1000 WAVELENGTH (nm) MTF of main scanning direction (Standard characteristics) Spatial frequency (cycles/mm) 0 1.0 14.3 28.6 42.9 57.1 71.4 0.8 0.6 MTF 0.4 0.2 0 0 0.2 0.4 0.6 0.8 1.0 Normalized spatial frequency Dark signal output temperature characteristics (Standard characteristics) Integration time output voltage characteristics (Standard characteristics) 10 5 Output voltage rate Output voltage rate 0 10 20 30 40 50 60 1 1 0.5 0.5 0.1 Ta-Ambient temperture (C) 0.1 1 5 int-integration time (ms) 10 --11-- ILX510 Operational frequency response of supply supply current (Standard characteristics) Ta = 25C IVDD-supply current (mA) 30 20 10 0 20 Data rate foR (MHz) 40 Offset level vs. VDD characteristics (Standard characteristics) Ta = 25C 10 VOS-Offset level (V) 8 6 4 VOS ~ -0.2 VDD 2 0 11.4 12.0 VDD (V) 12.6 Offset level vs. Temperature characteristics (Standard characteristics) 10 VOS-Offset level (V) 8 VOS Ta ~ 8 mV/C 6 4 2 0 10 20 30 40 50 60 Ta-Ambient temperature (C) --12-- ILX510 Notes of Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) Notes on Handling CCD Cer-DIP Packages The following points should be observed when handling and installing cer-DIP packages. a) Remain within the following limits when applying static load to the ceramic portion of the package: (1) Compressive strength: 39 N/surface (Do not apply load more than 0.7 mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29 N/surface (3) Tensile strength: 29 N/surface (4) Torsional strength: 0.9 Nm b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. Upper ceramic layer 39N 29N 29N 0.9Nm Lower ceramic layer (1) Low-melting glass (2) (3) (4) c) Be aware that any of the following can cause the glass to crack: because the upper and lower ceramic layers are shielded by low-melting glass, (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron (3) Rapid cooling or heating (4) Rapid cooling or impact to a limited portion of the low-melting glass with a small-tipped tool such as tweezers. (5) Prying the upper or lower ceramic layers away at a support point of the low-melting glass. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. 3) Soldering a) Make sure the package temperature does not exceed 80 C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a grounded 30 W soldering iron and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. --13-- ILX510 4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks. --14-- ILX510 Package Outline Unit : mm 22pin DIP (400mil) 55.7 0.5 11.12 0.5 22 36.05 (7m x 5150Pixels) H 1 54.2 11 1. The height from the bottom to the sensor surface is 2.38 0.3mm. 4.0 0.5 2.54 0.51 0.3 M PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT Cer-DIP TIN PLATING 42 ALLOY 7.1g --15-- 3.58 4.38 0.5 2. The thickness of the cover glass is 0.8mm, and the refractive index is 1.5. 0.25 V No.1 Pixel (AT STAND OFF) 10.16 12 5.0 0.5 9.0 10.0 0.5 0 to 9 |
Price & Availability of ILX510 |
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |